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Photo etching processing service [Basic knowledge of etching processing] is presented!

Possible from prototype to mass production. No-bridge etching with smooth edges without burrs, etc. Thin plate and large format processing, molybdenum processing also OK! Basic knowledge materials will also be provided.

Our company offers a "Photo Etching Processing Service" that applies etching to metal sheets and foils, such as cut sheets and roll materials. We can achieve flat processing without distortion or burrs, and we also support "Half Etching," which creates patterns on only one side, and "Taper Processing." Additionally, we can perform "No Bridge Etching," which has no bridges on the outer edges, "Backing Material Etching," which allows processing of thin sheets at the micron level, and we are capable of processing molybdenum, which requires advanced technology. 【Features】 ■ Capable of handling everything from prototypes to mass production ■ Prototype processing can be delivered in as little as 2 days ■ Supports large format processing up to 1050×1750mm ■ Smooth processing without burrs or distortion ■ Capable of producing perforated plates and mesh products * We are currently offering free information about our features and product examples! * We are also providing "Essential Knowledge of Etching Processing" for those who may not know! * For more details, please refer to the PDF materials or feel free to contact us.

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High-precision lead frame processing service

We will respond to our customers' needs by providing high quality, low prices, short delivery times, and large-scale production.

SDI Electronics Japan Co., Ltd. was established in 1999 through a joint investment by Nihon Filcon and SDI Corporation Taiwan (Shuntak Industry). It is a Japanese subsidiary that sells SDI Corporation products (such as lead frames for semiconductors) to customers in Japan. SDI Corporation (Shuntak Industry) has been in operation for over 60 years and currently possesses one of the largest production scales and advanced production technologies in the semiconductor lead frame processing industry, supplying globally. All processing steps, including materials (shaped materials), molds, pressing, plating, and molding, are carried out in-house for consistent production. We respond to customer needs by providing high quality, low prices, short delivery times, and large-scale production. For product specifications and designated delivery factories, we supply from our factories in Taiwan and China with optimal production support. ■ Main production items (lead frame types) For ICs: QFP/SOIC/QFN/SOIC, etc. For discrete & power: TO types/IGBT/IPM/terminal types, etc. Mold insert molding: Automotive LED/infrared sensors, etc. For industrial and automotive power modules: Copper base (base plates), etc.

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